Ceramic plates for CMP polishing
We could supply ceramic plates for chemically mechanical polishing with various outer diameter and thickness. This kind of plates could be used for chemically mechanical polishing of 3, 4, 5, 6 inch wafer. It has advantages such as high flatness and parallelism, compact and uniform microstructure and high cost performance.
Production description:
1. Good chemical stability, High abrasion resistant and Corrosion stability
2. Fast heat transfer
3. High flatness and No deformation
4. No pores, Scratches and Cracks
Diamond | Planeness |
D410mm | 2μm |
D360mm | 2μm |
D305mm | 2μm |
